3M CF Card Header CompactFlash Type I, Low Profile, Surface Mount 7E50 Series
This 3M CF Card Header, specifically the CompactFlash Type I, Low Profile, Surface Mount 7E50 Series, is designed for reliable data connection in electronic devices. It offers a low-profile height of 4.0 mm, making it suitable for space-constrained applications. Key features include a single row of solder tails with 0.635 mm spacing and an optional ejector for easy CF card removal. It meets CFA standards, ensuring compatibility with CompactFlash media.
Brand 3M
Product Series 7E50 Series
Standard CompactFlash Type I
Mounting Type Surface Mount
Profile Height 4.0 mm
Insulation Material Liquid Crystal Polymer (LCP)
Insulation Color Beige
Contact Material Copper Alloy
Underplating 100 [ 2.54 m ] Nickel
Wiping Area Plating Gold Flash over 80/20 Palladium Nickel, Lubricated
Solder Tails Plating Gold Flash
Flammability Rating UL 94V-0
Certifications UL File No.: E68080
| Specification | Value | Unit |
| Current Rating | 0.5 | A |
| Insulation Resistance | > 1 109 | at 500 VDC |
| Insulation Resistance (after Conditioning) | > 1 108 | at 500 VDC |
| Withstanding Voltage | 500 | VRMS at Sea Level |
| Temperature Rating | -55 to +85 | C |
| Process Rating (Max) | 260 | C (per J-STD-020C) |
| Pin Spacing (Solder Tails) | 0.635 | mm [0.0250] Typ |
| Pin Type | Pin No. | Dim A | Dim A (Inch) |
| detect | 3.50 | [ .138 ] |
| general | 4.25 | [ .167 ] |
| power | 5.00 | [ .197 ] |
| Option Description | Code |
| Inverse / with solder tab / ejector acceptable | A |
| Normal / without solder tab / ejector not acceptable | C |
| Normal / with solder tab / ejector not acceptable | D |
| Normal / with solder tab / ejector acceptable | E |
| Plating Option | Description |
| PG | Au Flash over 25 m [0.64 mm] PdNi Lubricated with Au Flash tails. Available for "D" product option only. |
| PK | Au Flash over 20 " [0.5 m] PdNi Lubricated with Au flash tails |
Regulatory Information
Appendix E1: EU RoHS Directive 2002/95/EC. Product is RoHS Compliant 2005/95/EC.
Appendix E2: EU RoHS Directive 2002/95/EC. Product contains lead in compliant pin area in excess of max concentration, compliant by exemption under EU Commission Decision 2005/747/EC.
Appendix E3: EU RoHS Directive 2002/95/EC. Product contains lead in solder tail area in excess of max concentration.
Appendix E4: EU RoHS Directive 2002/95/EC. Product contains decaBDE in insulating material in excess of max concentration, compliant by exemption under EU Commission Decision 2005/17/EC.
Appendix C1: China RoHS. Product does not contain specified hazardous substances in excess of maximum concentration limits.
Appendix C2: China RoHS. Product contains specified hazardous substances in excess of maximum concentration limits, as detailed in the chart (not provided in input).
