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MOQ : 10
Brand Name : HX TF-CARD H1.8
Card Connection Mode : Push-Push
Height Above Board : 1.8mm
Packaging Details : SMD
Card Type : MicroSD Card (TF Card)
Delivery Time : 1工作日
Model Number : HX TF-CARD H1.8
Description : Micro SD card (TF card) Connector and Ejector Push-Push Surface Mount
Card Detection : Yes
Connector Type : Connector and Ejector
Stock : 2000
Operating Temperature : -20℃~+70℃
This product specification defines the characteristics and test methods of the connector products designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. These connectors are designed for various applications requiring reliable electrical connections. The product is designed to meet electrical, mechanical, and environmental performance requirements specified in Table I.
Shenzhen Hanxia Electronic Co., Ltd
China
HX TF-CARD H1.8
HX TF-CARD H1.8
Compliant with RoHS directive requirements.
Products are packaged according to customer specified requirements. Uses tape and reel packaging. Specific specifications are shown in customer drawings.
Manufacturers name, industry-recognized logo, or customer-approved marks.
Any vehicle can be used for transportation, ensuring moisture-proof and no mechanical damage.
Temperature: -20 to +70; Relative humidity: 80%; Do not store in corrosive environments. Re-qualification test required if storage duration exceeds 6 months.
| Item | Requirements | Test Methods |
|---|---|---|
| 1. Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 40 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| 3. Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| 5. Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing | Mate and unmate connector for 5000 cycles. |
| 6. Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| 7. Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. | Contac |
| Section | Description | Details |
|---|---|---|
| 4.1. Solderability | Connector's solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | MIL-STD-202F . |
| 4.2. Resistance to Solder Heat (Wave Soldering) | Consists of three consecutive phases. | 4.2.1.1. Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. 4.2.1.2. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. 4.2.1.3. Cool Down: Cool down in ambient air at approximately 20 to 25. |
| 4.2. Resistance to Solder Heat (Infrared Reflow) | Three cycles. Each cycle consisting of three consecutive phases. | 4.2.2.1. Preheat: Increase in temperature not to exceed 4 per second. 4.2.2.2. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. 4.2.2.3. Cool Down: Cool down shall not exceed 6 per second. Note: Device temperature measurements are referenced from the top-center of the package outer surface. |
| 4.3. Cleaning | Connectors resist to cleaning process. | Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. |
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hanxia HX TF-CARD H1.8 Images |