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SHETIME MIS11-S1F1-2000-A

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SHETIME MIS11-S1F1-2000-A

Model Number : MIS11-S1F1-2000-A

Stock : 100000

MOQ : 1000

Operating Temperature : -25℃~+85℃

Packaging Details : SMD

Brand Name : MIS11-S1F1-2000-A

Delivery Time : 3-5工作日

Description : -25℃~+85℃ Push-Push 1.35mm MicroSIM Card SMD PC Card Sockets RoHS

Card Type : MicroSIM Card

Height Above Board : 1.35mm

Card Connection Mode : Push-Push

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Product Overview

This specification covers performance, tests and quality requirements for SIM MEMORY CARD CONNECTOR. These connectors provide space savings and improved functionality to system signal transfer.

Key Features:

Designed for SIM card connectivity.
Offers space savings and improved functionality.
Suitable for system signal transfer.

Brand GAOYUEDA (DONGGUAN GAOYUEDA ELECTRONICS CO.,LTD)

Customer P/N

Taiwan Factory

China Factory

Material (Housing) LCP S475 UL 94V-0

Material (Contact) C5191 (High performance copper alloy / Phosphor Bronze)

Material (Shell) SUS304-H

Finish (Contact Area) Gold over Nickel / GOLD FLASH PLATED ON CONTACT AREA

Finish (Solder Tail) Gold over Nickel / GOLD FLASH PLATED ON SOLDER TAILS

Color CD shell (Implied from product name)

Certifications UL94V-0

Package Type Reel

Part No.	Description	Rating Current (per pin)	Contact Resistance (Max)	Dielectric Withstanding (AC Min)	Insulation Resistance (Min)	Mating Cycles	Operating Temperature	Material (Housing)	Material (Contact)	Material (Shell)	Finish (Contact Area)	Finish (Solder Tail)
MIS22-S1F1-2000-A( MICOR SIM PUSN (6+1PCD))	SIM CARD INSERTED	0.5A MAX.	50 m MAX	500V AC MIN.	1000 M MIN.	3000 CYCLES	-25 TO +85	LCP S475 UL 94V-0	C5191	SUS304-H	GOLD FLASH PLATED ON CONTACT AREA	GOLD FLASH PLATED ON SOLDER TAILS
MIS11-S1F1-2000-A( MICOR SIM PUSN (6PCD))	CD shell WITHOUT SIM CARD	0.5A MAX.	50 m MAX	500V AC MIN.	1000 M MIN.	3000 CYCLES	-25 TO +85	LCP S475 UL 94V-0	C5191	SUS304-H	GOLD FLASH PLATED ON CONTACT AREA	GOLD FLASH PLATED ON SOLDER TAILS

Test Description	Requirement	Condition	Reference Standard
Low-Signal Level Contact Resistance	R<100 m	Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute.	MIL-STD-202F, Method 302
Insulation Resistance	R>1000 M	Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute.	MIL-STD-202F, Method 302
Dielectric Withstanding Voltage	No discharge, flashover or breakdown.	500 V initial and 250 Vfinal for 1 minute.	MIL-STD-202F, Method 301
Retention Force	100 Gram (0.98N) minimum (per pin)	Mate connector with a suitable gauge for each pin at rate of 25 mm/min.	MIL-STD-1344A, Method 2012.1
Vibration	Discontinuity 1.0 microsec. MAX	Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz.	MIL STD 202 Method 201
Durability	5000 cycles.	The sample should be mounted in the at the rate of 25mm/min.	MIL-STD-1344A, Method 2016
Solderability	Solderable area shall have minimum of 95% solder coverage.	Subject test area to flux for 30.5s, then into solder bath at 2705 for 30.5s.	N/A
Salt Spray	Oxidation of not more than 5%	Subject connectors to 51% salt-solution, 352 for 24 hours.	MTL-STD-1344A, Method 1001.1
Temperature Life (Heat Aging)	A. Products in 852 96 hours, can still be used normally. B. Products in 2605 or eight reflow cycles (max 260), deformation not more than 0.12 mm.	A. 852 for 96 hours. B. 2605 or eight reflow cycles.	MTL-STD-202F, Method 108A

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