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SHETIME TFW11-N1S1-2000-A

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SHETIME TFW11-N1S1-2000-A

Card Type : MicroSD Card

Packaging Details : SMD

Stock : 100000

Model Number : TFW11-N1S1-2000-A

Card Connection Mode : Push-Push

Brand Name : TFW11-N1S1-2000-A

Delivery Time : 3-5工作日

Description : Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS

MOQ : 1000

Height Above Board : 1.8mm

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Product Overview

Function: T-Flash external welding card holder (non-aligned terminals) connector.

Usage: Used for connecting T-Flash devices with external welding capabilities.

Application: Suitable for electronic devices requiring T-Flash connectivity with external soldering.

Brand (GYD)

Model Name TFW11-N1S1-2000-A

Type T-Flash type CONN.

Origin Taiwan Factory:

China Factory

Material Compliance RoHS directive

Packaging Tray or carrier tape as per purchase order; specific specifications in customer drawing.

Marking Manufacturers name, industry recognized logo, or customer approved marks.

Item	Requirements	Test Methods
Confirmation of Product	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
Contact resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
Durability (Repeated Mating/Unmating)	Contact Resistance: 100 m Max. after testing	(Implied by test sequence and requirements)

Parameter	Condition	Value
Storage Temperature	N/A	-25~+85
Storage Relative Humidity	N/A	80%
Solderability	MIL-STD-202F	Meets standard requirements
Wave Soldering Preheat	Max. temp increase rate	4/sec
Wave Soldering Preheat	Final preheat temperature	Within 125 of solder temperature
Wave Soldering	Solder wave temperature	2555
Wave Soldering	Max. duration in solder wave	5 seconds
Wave Soldering Cool Down	Ambient air temperature	20 to 25
Infrared Reflow Preheat	Max. temp increase rate	4/sec
Infrared Reflow	Time above 183	Max. 90 seconds
Infrared Reflow	Max. temperature	260
Infrared Reflow	Max. duration at max. temp	10 seconds
Infrared Reflow Cool Down	Max. cooling rate	6/sec
Cleaning (Aqueous)	Cycles	Three cycles
Cleaning (Aqueous)	Exposure time per cycle	Max. 1 minute
Cleaning (Aqueous)	Water temperature	54 to 66
Cleaning (Aqueous)	Max. pressure	30 psi
Cleaning (Aqueous) Air Drying	Duration	60 to 90 seconds
Cleaning (Aqueous) Air Drying	Air temperature	93 to 121

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