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SHETIME TFW13-N1S1-2000-A

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SHETIME TFW13-N1S1-2000-A

Description : Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS

Packaging Details : SMD

Height Above Board : 1.8mm

MOQ : 1000

Model Number : TFW13-N1S1-2000-A

Card Connection Mode : Push-Push

Card Type : MicroSD Card

Delivery Time : 3-5工作日

Brand Name : TFW13-N1S1-2000-A

Stock : 100000

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Product Overview

This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH., which is designed and manufactured by Company. This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH. connector products designed and manufactured by our company.

Customer

Customer P/N

TFW13-N1S1-2000-A

Product Name

T-Flash type CONN.

Rev.

A/0

Page No.

1 / 8

Taiwan Factory

China Factory

Material

The harmful material can follow the requirement of RoHS.

Packaging

Products required tray or carrier tape should meet the proper specification per purchase order. Connector container and the packaging specification is shown in customer drawing. The product uses tape packaging, specific specifications are shown in the customer drawing.

Marking

Manufacturers name, industry recognized logo, or customer approved marks.

Transportation

Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.

Storage

Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.

Technical Specifications

ItemRequirementsTest Methods
Confirmation of ProductProduct shall be conforming to the requirements of applicable product drawing.Visually, dimensions and functionally inspected per applicable product drawing.
Contact resistance (Low Level)80 m Max. initialSubject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation resistance1000 M Min.Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric StrengthConnector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max..Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301.
Durability (Repeated Mating/Unmating)Contact Resistance: 100 m Max. after testingMate and unmate connector for 5000 cycles.

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SHETIME TFW13-N1S1-2000-A Images

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