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Phoenix Contact 1814922

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Phoenix Contact 1814922

Color : White

Operating Temperature : -40℃~+100℃

Plastic Material : PA

MOQ : 600

Pitch : 2.5mm

With Locker : Non-Latching

Number of Rows : 1

Description : 2.5mm 1x3P 1 White 3 Non-Latching -40℃~+100℃ Solid State Lighting Connector Assemblies RoHS

Stock : 646

Packaging Details : -

Delivery Time : 10-15工作日

Number of Positions or Pins : 1x3P

With Wings : Without Fins

Model Number : 1814922

Brand Name : 1814922

Number of PINs Per Row : 3

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Product Overview

The PTSM 0,5/ 3-HH0-2,5-SMD WH R32 is a PCB header designed for integration into the SMT soldering process. It features a white design for stable color during welding and use, and is supplied in tape-on-reel packing according to IEC 60286-3 for automated mounting. Additional solder anchors enhance mechanical strain relief on soldering spots.

Product Attributes

  • Brand: Phoenix Contact
  • Product Range: PTSM 0,5/.. -HH-SMD WH
  • Color: Signal White
  • Country of Origin: IN
  • Certifications: UL Recognized (E118976-20130619), cULus Recognized (E60425-20110108), VDE Zeichengenehmigung (40048497)
  • Environmental Compliance: EU RoHS compliant, China RoHS compliant, EU REACH SVHC compliant

Technical Specifications

SpecificationValue
Product TypePCB header
Product FamilyPTSM 0,5/..-HH-SMD WH
Product LineCOMBICON Connectors XS
TypeStandard
Number of Positions3
Pitch2.5 mm
Number of Connections3
Number of Rows1
Number of Potentials3
Mounting TypeSMD soldering
Pin LayoutLinear pad geometry
Solder Pins per Potential1
Nominal Current (IN)6 A
Nominal Voltage (UN)160 V
Contact Resistance3 m
Rated Voltage (III/3)125 V
Rated Surge Voltage (III/3)2.5 kV
Rated Voltage (III/2)160 V
Rated Surge Voltage (III/2)2.5 kV
Rated Voltage (II/2)320 V
Rated Surge Voltage (II/2)2.5 kV
ProcessReflow soldering
Moisture Sensitive Level (MSL)1
Classification Temperature (Tc)260 C
Solder Cycles in Reflow3
Contact MaterialCu alloy
Surface CharacteristicsTin-plated
Metal Surface Contact Area (Top Layer)Tin (3 - 5 m Sn)
Metal Surface Contact Area (Middle Layer)Nickel (1.3 - 3 m Ni)
Metal Surface Soldering Area (Top Layer)Tin (3 - 5 m Sn)
Metal Surface Soldering Area (Middle Layer)Nickel (1.3 - 3 m Ni)
Housing ColorSignal white (9003)
Insulating MaterialPA
Insulating Material GroupI
CTI according to IEC 60112600
Flammability Rating according to UL 94V0
Width [w]13.1 mm
Height [h]5 mm
Length [l]9.5 mm
Installed Height5 mm
PCB Pad Geometry1.2 x 3.2 mm
Insertion Strength per Pos. (approx.)5 N
Withdraw Strength per Pos. (approx.)4 N
Insulation Resistance (neighboring positions)> 5 M
Minimum Clearance Value (III/3)1.5 mm
Minimum Creepage Distance (III/3)1.9 mm
Minimum Clearance Value (III/2)1.5 mm
Minimum Creepage Distance (III/2)1.5 mm
Minimum Clearance Value (II/2)1.5 mm
Minimum Creepage Distance (II/2)1.6 mm
Vibration Test Frequency10 - 150 - 10 Hz
Vibration Test Amplitude0.35 mm (10 Hz ... 60.1 Hz)
Vibration Test Acceleration5g (60.1 Hz ... 150 Hz)
Durability Test Cycles10
Climatic Test Corrosive Stress0.2 dm3 SO2 on 300 dm3/40 C/1 cycle
Climatic Test Thermal Stress100 C/168 h
Ambient Temperature (Operation)-40 C ... 100 C (dependent on derating curve)
Ambient Temperature (Storage/Transport)-40 C ... 70 C
Relative Humidity (Storage/Transport)30 % ... 70 %
Ambient Temperature (Assembly)-5 C ... 100 C
Type of Packaging32 mm wide tape
Tape Width [W]32 mm
Coil Overall Dimension [W2]38.4 mm
Coil Diameter [A]330 mm

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